 Manufacturing Specifications
IPC-600 Class 2 Standard manufacturing specifications
IPC-600 Class 3 Available as required
IPC-6012/ MIL-PRF-31032 Available as required with in-house testing capabilities
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Technologies
Single sided and double sided (rigid)
Multi-layer up to 22 layers (rigid)
Blind and buried vias
Controlled impedance
Controlled depth drilling
HDI technology
TDR testing
Electroless nickel/gold, White Tin, Silver
OSP, HASL, and SMOBC finishes
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Materials Used
FR-4 (high Tg)
FR-5
CEM-1
CEM-3
Getek
Polyimide
Teflon (high frequency)
Microwave/high frequency (Rogers 4003 type)
Cyanate ester
Ceramic filled dielectrics
Mixed dielectric constructions available as required
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Imaging
Inner layer pads .025" / 0.635mm oversize minimum
Smallest finished via .004" / 0.102mm
Standard pad size (.002"/ 0.051mm annular ring) .0085" / 0.216mm annular ring
(.017" / 0.432mm oversize)
Smallest pad size (.001" / 0.025mm annular ring) .0075" / 0.191mm annular ring
(.015" / 0.038mm oversize)
Standard line and spacing .005" / .005" (0.127mm / 0.127mm)
Special line and spacing .003" / .003" (0.076mm / 0.076mm)
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Drilling
Plated holes, standard tolerance ± .003" (± 0.076mm)
Non-plated holes ± .002" (± 0.051mm)
Recommended Aspect Ratio 5:1(drill diameter: material thickness)
Special Aspect Ratio 10:1
Blind via typical size .004" - .012" (0.102mm - 0.305mm) finished
Blind via aspect ratio 0.5:1 (drill depth: drill diameter)
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Multi-layer Pressing
Customer designs built with symmetric construction is preferred.
Inner layer core thickness .002" - .062" (0.051mm - 1.575mm)
Lamination Vacuum/pressure
Panel size 18" x 24" (457.2mm x 609.6mm)
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Plating
Minimum copper plating in holes .001"(25 µm)
Solder coat over bare copper Coverage and solderable per J-STD-003
White tin .000015" - .000035"(0.38 - 0.89 µm)tin
Silver .000003" - .000008"(0.076 - 0.203 µm)silver
Electroless nickel/gold .000003" - .000010"(0.076 - 0.254 µm)gold
Tab gold .000025" - .000030"(0.635 - 0.762 µm)gold
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Solder mask / Carbon Inks
Standard LPI .005" / 0.127mm annular ring (.010" / 0.254mm oversize)
Minimum LPI .0025" / 0.0635mm annular ring (.005" / 0.127mm oversize)
Solder mask "dam" between SM pads .004" / 0.102mm minimum
Ink types Matte, gloss, semi-gloss
Colors Green (standard), other colors as required
Thermal and UV inks Available as required
Plugged vias Available if necessary
Carbon Ink 30 ohms per square
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Silkscreen
Ink types Thermal and UV
Colors White (standard), most other colors available
as required
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Routing
Tolerance ± .005" / ± 0.127mm
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Scoring
Web range .012" - .020" / 0.305mm - 0.508mm
Web tolerance ± .003" / ± 0.076mm
Web angle 30 degrees, other angles available as required
Jump (skip) score Available as required
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Testing
Single/Double side Upto 17.5"x 11.0" (444.5mm x 279.4mm) testarea
access testing
Flying probe 18.0" x 24.0" (457.2mm x 609.6mm) test area
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Cleanliness
Ionic cleanliness <=2 µgrams Cl/in2 per IPC-TM-650 (2.3.28)
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Chemical Testing and Analysis (in-house)
- Cross sections
- Thermal stress analysis
- Solderability
- Hi-Pot testing
- X-ray fluorescence
- Ultraviolet and visible spectroscopy
- Metallurgical analysis
- Backlight analysis
- Multi-layer delamination analysis
- Waste treatment analysis
- Coupon testing (including Group A)
- NIST traceable
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Value Added Services
The following FREE services are provided for ALL customers on ALL new jobs:
- Automated design review check (DRC) Genesis 2000 software
- Engineering review
- Chemical engineering review and testing:
micro-section, ionic cleanliness and other surface contaminant analysis
- Vacuum packaged with dessicant
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Data Types and File Formats Supported
Gerber .gbr (274X preferred, 274D supported)
Autocad .dwg, .dxf
Hewlett-Packard .hpgl
Excellon .drl
International graphics .iges
Genesis ODB++
Mentor Neutral .mnfv*
IPC-D-356A .ipc
Manual tape ups Scanning conversions to .gbr
available as required
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Data Transmission
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Certifications
UL-94-V-0 listed
ISO9002
QS9000
TL9000
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Technology Roadmap
Laser drilling
Laser direct imaging
Advanced HDI technology
Buried passives
SEM/EDS - Scanning Electron Microscope/Energy Dispersion Scanning
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